Amkor Technology
flow-image

Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

Published by Amkor Technology

The whitepaper "Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era" by Amkor Technology explores three new high thermal conductivity thermal interface materials (TIMs) for large electronics packages. These include metal sheet TIM (60W/mK), graphite sheet TIM (24W/mK), and silver (Ag) sintered TIM (50W/mK). The paper discusses their workability, reliability, and effectiveness in thermal management, crucial for high-performance microprocessors in AI, HPC, and network applications, ensuring enhanced performance and reduced thermal resistance in advanced electronics packaging.

Download Now

box-icon-download

Required fields*

Please agree to the conditions

By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@headleymedia.com .

Related Categories Components, Power, Processors, PCB

More resources from Amkor Technology