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on the Sn Whisker Growth Propensity of Pulse Electronics Component Terminals:

Published by Pulse Electronics

The whitepaper "Tin Whiskers: Growth Propensity of Pulse Electronics Component Terminals" by Pulse Electronics addresses the challenges of tin whisker formation in lead-free electronic components. It examines sources of compressive stress, such as intermetallic compound growth and thermal expansion mismatches, and outlines mitigation strategies like minimal tin layer thickness, nickel underplating, and proper grain size. The document highlights Pulse's adherence to industry standards and recommendations for minimizing tin whisker growth, ensuring reliability and performance in high-reliability electronic applications.

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