Rochester Electronics, LLC
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Compatibility of Traditional Solderability Testing for Aged Semiconductor Components

Published by Rochester Electronics, LLC

The whitepaper "Compatibility of Traditional Solderability Testing for Aged Semiconductor Components" by Rochester Electronics assesses the effectiveness of traditional solderability tests on long-term stored SMT components. It compares "dip and look" and SMT simulation methods, finding no correlation between device age and solderability. The study concludes that standard solderability tests may not accurately predict board performance, suggesting that direct PCB mounting offers a more realistic assessment. This is crucial for electronics professionals managing aged semiconductor components to ensure reliability and reduce unnecessary rejections.

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