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ADVANCED ATE PCB HDI TECHNOLOGY AND HIGH ASPECT RATIO THRU HOLES

Published by Sanmina

The whitepaper "Advanced ATE PCB HDI Technology and High Aspect Ratio Thru Holes" by Sanmina highlights the design and fabrication challenges of Automatic Test Equipment (ATE) PCBs. It details Sanmina's solution for a semiconductor company's high-performance System-on-Chip (SOC) ATE PCB with 1000-ball, 0.4mm pitch BGA. Key features include 36 layers, high-speed differential impedance, and advanced via-in-pad processes. Sanmina's expertise in high-speed PCBs, material selection, and end-to-end design ensured superior signal integrity and cost-effective production, essential for electronics professionals in high-density, high-speed applications.

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